首页  |  本刊简介  |  编委会  |  投稿须知  |  订阅与联系  |  微信  |  出版道德声明  |  Ei收录本刊数据  |  封面
氧化铜纳米颗粒对水稻幼苗根系代谢毒性的研究
摘要点击 2076  全文点击 1118  投稿时间:2013-09-22  修订日期:2013-11-08
查看HTML全文 查看全文  查看/发表评论  下载PDF阅读器
中文关键词  氧化铜纳米颗粒  水稻    代谢  毒性
英文关键词  copper oxide nanoparticles  rice  root  metabolism  toxicity
作者单位E-mail
王淑玲 青岛农业大学生命科学学院,青岛 266109 wangshl0309@163.com 
张玉喜 青岛农业大学生命科学学院,青岛 266109  
刘汉柱 青岛农业大学生命科学学院,青岛 266109  
辛华 青岛农业大学生命科学学院,青岛 266109
山东省植物生物技术高校重点实验室,青岛 266109 
hxin@qau.edu.cn 
中文摘要
      为阐明氧化铜纳米颗粒(CuO NPs)暴露对植物生长的影响,分别用CuO NPs悬浮液、氧化铜大颗粒(CuO BPs)悬浮液和硫酸铜(CuSO4·5H2 O)溶液进行处理,以蒸馏水(d H2O)作为对照,水培水稻幼苗,研究了CuO NPs对水稻幼苗根系相关生理生化行为的影响. 结果表明,不同处理对水稻幼苗根系的影响有很大差异,经CuO NPs悬浮液处理后,水稻幼根受损较严重,根系活力明显降低,根内丙二醛(MDA)含量和过氧化氢(H2O2)含量显著升高,超氧化物歧化酶(SOD)和过氧化物酶(POD)活性明显增强. 不同处理对水稻幼苗根的影响依次为:CuO NPs>CuSO4·5H2 O>CuO BPs>d H2O. 说明氧化铜纳米颗粒对水稻根的毒害作用不仅是由于释放离子引起的,纳米颗粒本身也起着重要作用,氧化损伤可能是CuO NPs的主要致毒机制之一.
英文摘要
      To study the toxicity of copper oxide nanoparticles (CuO NPs) on plant growth, the physiological and biochemical activities of rice (Oryza sativa L.) seedlings were detected under different kinds of treatments (CuO NPs suspension, CuO BPs suspension and CuSO4·5H2 O solution), using distilled water (d H2O) culture as contrast. The results showed that the response of rice roots to four treatments was very different. After treated with CuO NPs suspension, the rice roots were seriously damaged, the root activity obviously decreased, the MDA and H2O2 content rose, and the activity of SOD and POD apparently increased. The effect of different treatments on rice roots followed the order of CuO NPs>CuSO4·5H2 O>CuO BPs>d H2O. The results demonstrated that CuO NPs had a serious effect on the root growth of rice, the toxicity of nanoparticles on rice root was not only caused by the release of Cu ion, the particles also played an important role, and that oxidative damage might be one of the main toxic mechanisms of copper oxide nanoparticles.

您是第54735904位访客
主办单位:中国科学院生态环境研究中心 单位地址:北京市海淀区双清路18号
电话:010-62941102 邮编:100085 E-mail: hjkx@rcees.ac.cn
本系统由北京勤云科技发展有限公司设计  京ICP备05002858号-2