| 无铅焊料合金中重金属元素浸出行为的研究 |
| 摘要点击 2560 全文点击 1561 修订日期：2007-09-24 |
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| 中文关键词 无铅焊料 重金属元素 腐蚀溶液 浸出行为 |
| 英文关键词 lead-free solder heavy metal element corrosion solution leaching behavior |
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| 中文摘要 |
| 选用Sn-3.5Ag-0.5Cu、Sn-3.5Ag、Sn-0.5Cu无铅焊料合金及它们与Cu的钎焊接头，研究了它们在典型的酸性、碱性和盐溶液中的重金属元素的浸出规律.结果表明，焊料合金中的主要浸出元素Sn在酸性或碱性溶液中的浸出量都不是太多，而在NaCl盐溶液中浸出量增大2个数量级.制备成钎焊接头后，在酸性环境中，Sn-3.5Ag和Sn-0.5Cu钎焊接头中Sn的浸出量增加1个数量级以上，而在NaOH碱性环境中，Sn-3.5Ag-0.5Cu钎焊接头中Sn的浸出量相对较高.该结果对电子垃圾填埋环境选择及相关决策提供了参考. |
| 英文摘要 |
| Leaching behavior of heavy metal elements from Sn-3.5Ag-0.5Cu，Sn-3.5Ag，Sn-0.5Cu lead-free solders and their joints were investigated in typical acid, alkaline and saline corrosion solutions. It is found that for solder alloys, significant leaching of Sn was observed in NaCl saline solution, about two orders of magnitude higher than that in acid and alkaline solution. However, in the case of solder joints, more leaching of Sn was observed in acid solution from Sn-3.5Ag/Cu and Sn-0.5Cu/Cu joints, and in NaOH alkaline solution for Sn-3.5Ag-0.5Cu joint. |
